• Schematic/Board Design (single to multi-layer) with advanced knowledge of heat dissipation (i.e. copper slugs,
gradient vias) and board materials (i.e. FR4, Polyimide)
• High speed circuit design (i.e. PCIe), Field-programmable gate array (FPGA) and digital signal processing (DSP)
• Component procurement and Bill of Material (BOM) Generation
• PCB fabrication, testing, and assembly support
• Firmware Development (C/C++)
Landi Industries has experience in designing everything from oil rig sensor boards to FPGAs for computing leading all our projects with Test Driven Development (TDD). We help customers make it through rigorous testing and high demand situations for their products.